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SN74AHCT1G08

SCLS315Q –MARCH 1996–REVISED APRIL 2016

SN74AHCT1G08 Single 2-Input Positive-AND Gate

1 Features

•Operating Range: 4.5 V to 5.5 V

•Maximum tpd of 7.1 ns at 5 V

•Low Power Consumption: Maximum ICC of 10-µA

•±8-mA Output Drive at 5 V

•Inputs Are TTL-Voltage Compatible

•Latch-Up Performance Exceeds 250 mA Per JESD 17

2 Applications

•TV, Set-Top Box, and Audio

•Wireless Infrastructure

•Factory Automation and Control

•PC and Notebooks

•Building Automation

•Grid Infrastructure

•Medical, Healthcare, and Fitness

•Printers

•Test and Measurement

•EPOS (Electronic Point of Sale)

•Telecom Infrastructure

•Projectors

3 Description

The SN74AHCT1G08 device is a single 2-input positive-AND gate. The device performs the Boolean function Y = A • B or Y = A + B in positive logic. Low ICC current allows this device to be used in powersensitive or battery-powered applications.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

SN74AHCT1G08DBVR

SOT-23 (5)

2.90 mm x 1.60 mm

SN74AHCT1G08DCKR

SC70 (5)

2.00 mm x 1.25 mm

SN74AHCT1G08DRLR

SOT (5)

1.60 mm x 1.20 mm

(1)For all available packages, see the orderable addendum at the end of the data sheet.

 

 

Logic Diagram

A

1

 

 

 

 

 

 

4

Y

2

 

B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74AHCT1G08

SCLS315Q –MARCH 1996 –REVISED APRIL 2016 www.ti.com

Table of Contents

1

Features ..................................................................

1

 

8.2

Functional Block Diagram .........................................

7

2

Applications ...........................................................

1

 

8.3

Feature Description...................................................

7

3

Description .............................................................

1

 

8.4

Device Functional Modes..........................................

7

4

Revision History.....................................................

2

9

Application and Implementation ..........................

8

5

Pin Configuration and Functions

3

 

9.1

Application Information..............................................

8

 

9.2

Typical Application

8

6

Specifications

3

 

10

Power Supply Recommendations

9

 

6.1

Absolute Maximum Ratings

3

 

11

Layout

9

 

6.2

ESD Ratings..............................................................

3

 

6.3

Recommended Operating Conditions

4

 

11.1

Layout Guidelines ...................................................

9

 

 

11.2

Layout Example

9

 

6.4

Thermal Information

4

 

 

12

Device and Documentation Support

10

 

6.5

Electrical Characteristics...........................................

4

 

6.6

Switching Characteristics ..........................................

5

 

12.1

Documentation Support ........................................

10

 

6.7

Operating Characteristics..........................................

5

 

12.2

Community Resources..........................................

10

 

6.8

Typical Characteristics ..............................................

5

 

12.3

Trademarks ...........................................................

10

7

Parameter Measurement Information ..................

6

 

12.4

Electrostatic Discharge Caution............................

10

8

Detailed Description

7

 

12.5

Glossary ................................................................

10

13

Mechanical, Packaging, and Orderable

 

 

8.1

Overview ...................................................................

7

10

 

 

 

 

 

Information ...........................................................

 

 

 

 

 

 

 

 

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision P (May 2013) to Revision Q

Page

•Added Applications section, Device Information table, Table of Contents, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Thermal Information table, Typical Characteristics section, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section

...... 1

Changes from Revision O (June 2005) to Revision P

Page

• Extended operating temperature range to 125°C...................................................................................................................

4

2

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Copyright © 1996–2016, Texas Instruments Incorporated

Product Folder Links: SN74AHCT1G08

 

 

 

SN74AHCT1G08

www.ti.com

 

 

SCLS315Q –MARCH 1996–REVISED APRIL 2016

5 Pin Configuration and Functions

 

 

 

DBV, DCK, and DRL Packages

 

 

5-Pin SOT-23, SC70, and SOT

 

 

 

Top View

 

A

1

5

VCC 

B

2

 

 

GND

3

4

Y

 

 

 

 

Pin Functions

 

PIN

I/O

DESCRIPTION

NAME

 

NO.

 

 

 

A

 

1

I

Input A

B

 

2

I

Input B

GND

 

3

—

Ground Pin

VCC

 

5

—

Supply Pin

Y

 

4

O

Output

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted).(1)

 

 

MIN

MAX

UNIT

Supply voltage

 

–0.5

7

V

Input voltage(2)

 

–0.5

7

V

Output voltage(2)

 

–0.5

VCC + 0.5

V

Input clamp current

VI < 0

 

–20

mA

Output clamp current

VO < 0 or VO > VCC

 

±20

mA

Continuous output current

VO = 0 to VCC

 

±25

mA

Continuous current through VCC or GND

 

 

±50

mA

Maximum junction temperature, TJ

 

 

150

°C

Storage temperature, Tstg

 

–65

150

°C

(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2

ESD Ratings

 

 

 

 

 

 

 

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

 

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

(2)

±1000

 

 

 

(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Copyright © 1996–2016, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Links: SN74AHCT1G08

SN74AHCT1G08

SCLS315Q –MARCH 1996 –REVISED APRIL 2016

www.ti.com

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

 

 

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VIH

High-level input voltage

2

 

V

VIL

Low-level input voltage

 

0.8

V

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

 

–8

mA

IOL

Low-level output current

 

8

mA

t/ v

Input transition rise and fall rate

 

20

ns/V

TA

Operating free-air temperature

–40

125

°C

(1)All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

 

 

 

SN74AHCT1G08

 

 

 

THERMAL METRIC(1)

DBV (SOT-23)

DCK (SC70)

DRL (SOT)

UNIT

 

 

5 PINS

5 PINS

5 PINS

 

RθJA

Junction-to-ambient thermal resistance

226

277.5

242.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

165

92.9

77.5

°C/W

RθJB

Junction-to-board thermal resistance

59.1

64.2

77.5

°C/W

ψJT

Junction-to-top characterization parameter

45.5

1.9

9.6

°C/W

ψJB

Junction-to-board characterization parameter

58.3

63.5

77.3

°C/W

(1)For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

IOH = –50 µA, VCC = 4.5 V

TA = 25°C

4.4

4.5

 

 

VOH

High-level output

TA = –40°C to 125°C

4.4

 

 

V

 

 

 

voltage

IOH = –8 mA, VCC = 4.5 V

TA = 25°C

3.94

 

 

 

 

 

 

 

 

TA = –40°C to 125°C

3.8

 

 

 

 

 

 

 

 

 

 

Low-level output

IOL = 50 µA, VCC = 4.5 V

 

 

 

0.1

 

VOL

 

TA = 25°C

 

 

0.36

V

voltage

IOL = 8 mA, VCC = 4.5 V

 

 

 

TA = –40°C to 125°C

 

 

0.44

 

 

 

 

 

 

 

II

Input current

VI = 5.5 V or GND,

TA = 25°C

 

 

±0.1

µA

VCC = 0 V to 5.5 V

TA = –40°C to 125°C

 

 

±1

 

 

 

 

 

ICC

Supply current

VI = VCC or GND, IO = 0,

TA = 25°C

 

 

1

µA

VCC = 5.5 V

TA = –40°C to 125°C

 

 

10

 

 

 

 

 

(1)

Change in supply

One input at 3.4 V, Other Inputs

TA = 25°C

 

 

1.35

 

ICC

current

at VCC or GND, VCC = 5.5 V

 

 

 

 

mA

TA = –40°C to 125°C

 

 

1.5

 

 

 

 

CI

Input capacitance

VI = VCC or GND, VCC = 5 V

 

 

4

10

pF

(1)This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.

4

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Copyright © 1996–2016, Texas Instruments Incorporated

Product Folder Links: SN74AHCT1G08

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